DESCRIPTION
Features • Low-voltage and Standard-voltage Operation – 2.7 (VCC = 2.7V to 5.5V) – 1.8 (VCC = 1.8V to 5.5V) • Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K), 1024 x 8 (8K) or 2048 x 8 (16K) • Two-wire Serial Interface • Schmitt Trigger, Filtered Inputs for Noise Suppression • Bidirectional Data Transfer Protocol • 100 kHz (1.8V) and 400 kHz (2.7V, 5V) Compatibility • Write Protect Pin for Hardware Data Protection • 8-byte Page (1K, 2K), 16-byte Page (4K, 8K, 16K) Write Modes • Partial Page Writes Allowed • Self-timed Write Cycle (5 ms max) • High-reliability – Endurance: 1 Million Write Cycles – Data Retention: 100 Years • Automotive Devices Available • 8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2x3), 5-lead SOT23, 8-lead TSSOP and 8-ball dBGA2 Packages • Die Sales: Wafer Form, Waffle Pack and Bumped Wafers
ADDITIONAL INFORMATION
| Color: |
Blue, Purple, White |
| Size: |
20, 24 |
| Material: |
100% Polyester |
